Low Modulus Hybrid Sealant


WPA SPUR is a high quality, professional, universal, low modulus sealant based on hybrid technology. WPA SPUR cures under the influence of atmospheric moisture and is free of solvents and isocyanates with a very low VOC content. When cured it forms a tough, flexible seal and bond, capable of cyclic expansion and compression movement. Joints or fabrications formed with this sealant can be expected to extend and compress a total of 50% (± 25%) of original joint dimensions to ASTM C719.

  • Excellent adhesion without primer to most, even damp surfaces.

  • Low modulus (±25% joint movement).

  • Moisture curing, almost odourless.

  • Free of isocyanates, solvents and silicones.

  • No shrinkage.

  • No bubbling.

  • Good resistance to UV, water and weather.

  • Permanently elastic.

  • High mechanical resistance.

Recommended uses:

  • In situ concrete and render.

  • Precast and tilt up panels, brickwork and block work.

  • Plasterboard face and paper lined recessed edges.

  • Fibre cement sheet.

  • Aluminium windows.

  • GRC, fiberglass and mostly specialty panel systems.

  • Treated timber and stainless steel.

  • Bond breaker/fillet sealant for use with selected waterproofing membranes from the WPA product range.